Redmi is reportedly working on the Note 14 series of smartphones for China. The company will likely release it in August or September. Earlier this month, tipster Digital Chat Station released a Weibo post to reveal the design of the Note 14 Pro. A previous leak by the tipster also revealed that the upcoming Snapdragon 7s Gen 3 will power the device. In a new Weibo post released today, DCS appears to have suggested that the Note 14 Pro+ will have a Dimensity chip onboard.Redmi Note 14 Pro+ could be powered by Dimensity 7350
In the above-shown Weibo post, DCS has not revealed the name that it is talking about. However, it seems that he could be talking about one of the Note 14 series of smartphones. Since the leaker described the device as having a “super cup” in the leak, it appears that he could be talking about the Redmi Note 14 Pro+.
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According to the leak, the Redmi Note 14 Pro+ may come with a 1.5K resolution curved-edge OLED panel. The phone’s back will feature an elliptical camera module with a 50-megapixel primary camera. To recall, the design schematic for the Note 14 Pro revealed that it could be a squricle camera module.
The leaker claims that the Note 14 Pro+ will feature a plastic frame and an optical in-screen fingerprint sensor for security. Under the hood, the Pro+ model will have the Dimensity chipset built using TSMC’s second-generation 4nm process with a 3GHz main frequency. He speculated in the comments section that the Dimensity 7350 chipset powers the device. This is the same chip that powers the upcoming Nothing Phone (2a) Plus, which is scheduled to launch on July 31 in India.Redmi Note 14 Pro+ could be powered by Dimensity 7350
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